IEC 60068-2-106:2014 and IEC 60068-2-85:2014 are both international standards that provide guidelines for environmental testing of equipment and components. These standards, respectively, focus on testing for mold growth and environmental conditions in dynamic mechanical loads, respectively.
IEC 60068-2-106:2014, also known as "Environmental testing - Part 2-106: Tests - Test Xb and guidance: Mould growth, " is specifically tailored for mold growth testing. It provides guidelines to evaluate the resistance of products against mold growth and assess their durability in the presence of mold. The standard specifies a set of environmental conditions and associated tests for mechanical stresses, such as mechanical vibrations, shock, and free fall.
In contrast, IEC 60068-2-85:2014, also known as "Environmental testing - Part 2-85: Environmental conditions and tests for telecommunications equipment, " is focused on testing and assessing the behavior of components, equipment, and other products in environmental conditions with dynamic mechanical loads. The standard defines a method to test and assess the product's performance, reliability, and safety in various scenarios, including mechanical vibrations, shock, and transportation hazards.
The objective of IEC 60068-2-85:2014 is to define a set of environmental conditions and associated tests specifically tailored for telecommunications equipment. It provides manufacturers with a standardized testing procedure to evaluate their products' suitability for deployment in various real-life scenarios and consider necessary design modifications or enhancements.
Both IEC 60068-2-106:2014 and IEC 60068-2-85:2014 are essential for ensuring that products meet the necessary performance, safety, and reliability standards. By subjecting products to standardized testing procedures outlined in these standards, manufacturers can provide confidence in their products' ability to withstand various environmental conditions and challenges.
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